DocumentCode
1465153
Title
Integrated amorphous and polycrystalline silicon thin-film transistors in a single silicon layer
Author
Pangal, Kiran ; Sturm, James C. ; Wagner, Sigurd
Author_Institution
Flash Technol. Dev. & Manuf., Intel Corp., Santa Clara, CA, USA
Volume
48
Issue
4
fYear
2001
fDate
4/1/2001 12:00:00 AM
Firstpage
707
Lastpage
714
Abstract
Using a masked hydrogen plasma treatment to spatially control the crystallization of amorphous silicon to polycrystalline silicon in desired areas, amorphous and polycrystalline silicon thin-film transistors (TFTs) with good performance have been integrated in a single film of silicon without laser processing. Both transistors are top gate and shared all process steps. The polycrystalline silicon transistors have an electron mobility in the linear regime of ~15 cm2/Vs, the amorphous silicon transistors have a linear mobility of ~0.7 cm2/Vs and both have an ON/OFF current ratios of >105. Rehydrogenation of amorphous silicon after the 600°C crystallization anneal using another hydrogen plasma is the critical process step for the amorphous silicon transistor performance. The rehydrogenation power, time, and reactor history are the crucial details that are discussed in this paper
Keywords
amorphous semiconductors; annealing; crystallisation; electron mobility; elemental semiconductors; hydrogenation; plasma materials processing; silicon; thin film transistors; 600 C; Si; amorphous silicon thin film transistor; crystallization annealing; linear electron mobility; masked hydrogen plasma treatment; on/off current ratio; polycrystalline silicon thin film transistor; rehydrogenation; single silicon layer; Amorphous materials; Amorphous silicon; Crystallization; Electron mobility; Hydrogen; Optical control; Plasma materials processing; Semiconductor films; Semiconductor thin films; Thin film transistors;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.915699
Filename
915699
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