Title :
An Optomechatronics Inspection Technique of TFT Array Flaw Applied to Medical Display
Author :
Yao-Chin Wang ; Bor-Shyh Lin
Author_Institution :
Inst. of Photonic Syst., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
For medical display, the pixels on array panels are getting smaller. Therefore, flaw detection and measurement are getting more difficult and critical for managing yield and quality in a thin-film-transistor (TFT) array process. The TFT array testing technique has been used for flaw detection and process yield control. As the TFT array pixel size is getting smaller and the resolution is getting higher, both of them have encountered a performance limitation in detecting the critical small-pixel defect for the ultrahigh-resolution TFT array such as medical display applications. In this study, a novel approach for flaw detection is proposed. The proposed optomechatronics technique with interdigitized shorting bar design configuration is used for inspection. The experimental results show that, by using the voltage imaging technique, the flaw detection rate for small-pixel size, high-resolution TFT array has been effectively improved from 50% to 80%. The detected subpixel size for a TFT array panel can be smaller than 53 μm for a 30-inch ultrahigh-definition medical display application.
Keywords :
biomedical equipment; flat panel displays; flaw detection; inspection; thin film transistors; TFT array flaw; TFT array testing technique; flaw detection; interdigitized shorting bar design configuration; optomechatronics inspection technique; optomechatronics technique; process yield control; size 30 inch; small pixel defect; thin film transistor array process; ultrahigh definition medical display application; ultrahigh resolution TFT array; Arrays; Biomedical imaging; Inspection; Logic gates; Thin film transistors; Voltage measurement; Flaw detection; medical display; optomechatronics inspection; thin-film-transistor (TFT) array; ultrahigh-definition (UHD);
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
DOI :
10.1109/TMECH.2014.2306439