Title :
A 300-A delta VF tester
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
fDate :
8/1/1990 12:00:00 AM
Abstract :
The design and development of a relatively low-cost, high-current, transient thermal resistance tester are described. The tester, which employs delta techniques, was initially used to measure the die bond integrity of large power handling rectifier assemblies, but because of its versatility it can thermally characterize most semiconductor junctions. Circuit design details and testing of several products are illustrated, including the delta VF and V F measurements of power rectifiers and smart power ICs
Keywords :
integrated circuit testing; production testing; semiconductor device testing; test equipment; thermal resistance measurement; transients; voltage measurement; 300 A; delta VF tester; die bond integrity; inspection; power MOSFET switch; power rectifiers; semiconductor junctions; smart power ICs; transient thermal resistance tester; Assembly; Bonding; Circuit synthesis; Circuit testing; Electrical resistance measurement; Power integrated circuits; Power measurement; Rectifiers; Semiconductor device testing; Thermal resistance;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
