Performance Characterization Methods for Optoelectronic Circuit Boards

Author

Chandrappan, Jayakrishnan ; Kuruveettil, Haridas ; Wei, Tan Chee ; Liang, Calvin Teo Wei ; Ramana, Pamidighantam V. ; Suzuki, Kenji ; Shioda, Tsiyoshi ; Lau, John H.

Author_Institution

Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore

Volume

1

Issue

3

fYear

2011

fDate

3/1/2011 12:00:00 AM

Firstpage

318

Lastpage

326

Abstract

This paper illustrates the performance evaluation methods for bidirectional optoelectronic circuit boards (OECBs) operating at 10 Gb/s. A typical OECB consists of flip chip surface mount optical transceiver modules and polymer optical interconnects. The evaluation techniques include direct current and high-speed optical characterizations of individual components, subsystems, and interconnect. A methodical procedure to validate optical waveguide, vertical cavity surface emitting laser, photodiode, high-speed optical characterization of transmitter, receiver, and optical link is described.

Keywords

flip-chip devices; integrated circuit interconnections; lasers; optical communication equipment; optical links; optical transceivers; optical waveguides; optoelectronic devices; bidirectional optoelectronic circuit boards; flip chip surface mount optical transceiver modules; high-speed optical characterization; high-speed optical characterizations; optical link; optical waveguide; photodiode; polymer optical interconnects; receiver; transmitter; vertical cavity surface emitting laser; Assembly; Lenses; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Vertical cavity surface emitting lasers; Characterization; VCSEL; optical waveguide; optoelectronic circuit boards (OECBs); receiver; transmitter;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2010.2100654

Filename

5724293