Title :
Heat conduction in microbes exposed to pulsed electric fields
Author :
Bruhn, R.E. ; Pedrow, P.D. ; Olsen, R.G. ; Barbosa-Canovas, G.V. ; Swanson, B.G.
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
fDate :
12/1/1998 12:00:00 AM
Abstract :
Nonthermal pasteurization of liquid foods by intense pulsed electric fields results in advantages over conventional heat pasteurization. Thermal damage to liquid foods can adversely affect the flavor and taste and result in loss of nutrients. Numerical modeling of heating parameters near the microbe during exposure to these intense electric fields is described. Boundary conditions at membrane interfaces included the continuity of temperature and continuity of heat flow. Temperature, heat flow vector, and heat source were included in the one-dimensional model. Two simulations are reported here. Simulation 1 consisted of a 0.5 μm wide microbe suspended in liquid with conductivity of 0.01 S/m and was treated with an applied electric field of 40 kV/cm for 375 ns. Simulation 2 contained a 1.0 μm wide microbe suspended in liquid with conductivity of 0.1 S/m and was treated with an applied electric field of 40 kV/cm for 1 μs. Comparison is made with a uniform conductivity model (ohmic), and it is shown that significant differences exist in the heating parameters between the two models. For the parameters used in these one-dimensional simulations, conditions for electroporation were found to exist without a significant temperature rise in the microbe
Keywords :
bioelectric phenomena; biological effects of fields; biothermics; food processing industry; heat conduction; microorganisms; electroporation; heat conduction; liquid food; membrane interface; microbe; nonthermal pasteurization; numerical model; one-dimensional simulation; pulsed electric field; Biological systems; Biomembranes; Computer science; Conductivity; Dairy products; Modeling; Resistance heating; Systems engineering and theory; Temperature; Voltage;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on