Title :
A better understanding of substrate enhanced gate current in VLSI MOSFETs and flash cells. II. Physical analysis
Author :
Selmi, Luca ; Esseni, David
Author_Institution :
Dipt. di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
fDate :
2/1/1999 12:00:00 AM
Abstract :
For pt. I see ibid., vol. 46, no. 2 (Feb. 1999). In this work-different physical mechanisms that could lead to the direct proportionality between IG and IB as the signature of substrate enhanced electron injection (SEEI), are analyzed in detail. By means of experiments and simulations we substantiate the current interpretation of SEEI in terms of an impact ionization feedback process and attribute a quantitatively negligible role to both drain avalanche hot electron injection and substrate electrons generated by the photons emitted by channel hot electrons. These experiments reconcile the current explanation of SEEI with the well known phenomenon of photon assisted minority carrier injection in the substrate, whose presence is clearly detectable in our devices, but whose impact on the gate current is estimated to be orders of magnitude smaller than that of impact ionization feedback
Keywords :
MOS memory circuits; VLSI; flash memories; hot carriers; impact ionisation; integrated circuit reliability; EPROM; MOSFET; VLSI; channel hot electrons; drain avalanche hot electron injection; flash cells; impact ionization feedback process; minority carrier injection; physical analysis; substrate enhanced electron injection; substrate enhanced gate current; Channel hot electron injection; Charge carrier processes; Electron emission; Feedback; Hot carriers; Impact ionization; MOSFET circuits; Substrate hot electron injection; Very large scale integration; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on