DocumentCode :
1467040
Title :
Electronic packaging and interconnection handbook, 3/sup rd/ edition [Book Review]
Author :
Shea, John
Author_Institution :
Cutler-Hammer, Inc.
Volume :
17
Issue :
2
fYear :
2001
Firstpage :
68
Lastpage :
69
Keywords :
Book reviews; Chemical technology; Components, packaging, and manufacturing technology; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Sections; Thermal stresses; Thermomechanical processes; Wiring;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2001.917557
Filename :
917557
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1467040
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