DocumentCode :
1467302
Title :
A 25-ns 4-Mbit CMOS SRAM with dynamic bit-line loads
Author :
Miyaji, Fumio ; Matsuyama, Yasushi ; Kanaishi, Yoshikazu ; Senoh, Katsunori ; Emori, Takashi ; Hagiwara, Yoshiaki
Author_Institution :
Semicond. Group, Res. & Dev. Div., Sony Corp., Atsugi, Japan
Volume :
24
Issue :
5
fYear :
1989
fDate :
10/1/1989 12:00:00 AM
Firstpage :
1213
Lastpage :
1218
Abstract :
A 25-ns 4-Mbit CMOS SRAM with 512 K word*8-bit organization has been developed. The RAM was fabricated using a 0.5- mu m double-poly and double-aluminum CMOS technology and was assembled in a 32-pin 400-mil DIP. A small cell size of 3.6*5.875 mu m2 and a chip size of 7.46*17.41 mm2 were obtained. A fast address access time of 25 ns with a single 3.3-V supply voltage has been achieved using the newly developed dynamic bit-line load (DBL) circuit scheme incorporated with an address transition detector (ATD), divided word-line structure (DWL), three-stage sense amplifier, and low-noise output circuit approach. A low operating current of 46 mA at 40 MHz and low standby currents of 70 mu A (TTL) and 5 mu A (CMOS) were also attained.
Keywords :
CMOS integrated circuits; VLSI; integrated circuit technology; integrated memory circuits; random-access storage; 0.5 micron; 25 ns; 3.3 V; 3.6 to 5.876 micron; 4 Mbit; 40 MHz; 400 mil; 46 mA; 5 muA; 512 kbyte; 7.46 to 17.41 mm; CMOS; DIP; SRAM; access time; address transition detector; divided word-line structure; double metal; double-poly; dynamic bit-line loads; low-noise output circuit; operating current; standby currents; three-stage sense amplifier; Assembly; CMOS technology; Circuits; Detectors; Electronics packaging; Low-noise amplifiers; Power supplies; Random access memory; Read-write memory; System testing; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1989.572582
Filename :
572582
Link To Document :
بازگشت