DocumentCode
1467676
Title
Integration of Array Antennas in Chip Package for 60-GHz Radios
Author
Liu, Duixian ; Zhang, Y.P.
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
100
Issue
7
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
2364
Lastpage
2371
Abstract
This paper discusses the integration of array antennas in chip packages for highly integrated 60-GHz radios. First, we evaluate fixed-beam array antennas, showing that most of them suffer from feed network complexity and require sophisticated process techniques to achieve enhanced performance. We describe the grid array antenna and show that is a good choice for fixed-beam array antenna applications due to its easy feed network design and manufacture. Then, we examine switched-beam array antennas using the Rotman lens or Butter matrix, illustrating that they allow scanning only in one plane and some miss a link even in the boresight direction. Nevertheless, a switched-beam array antenna uses a conceptually simple switch circuit to select the best signal path and may be a cost-effective approach to implementing steerable antennas in the 60-GHz band. Finally, we describe adaptive beam or phased array antennas and highlight the challenges and practical realizations of phased array antennas in both ceramic and organic chip packages for single-chip 60-GHz radios.
Keywords
antenna arrays; chip-on-board packaging; radiocommunication; Butter matrix; Rotman lens; chip package; easy feed network design; feed network complexity; fixed-beam array antennas; frequency 60 GHz; grid array antenna; integration; radios; switched-beam array antennas; Antenna measurements; Arrays; Bandwidth allocation; Microstrip antenna arrays; Substrates; System-on-a-chip; 60 GHz; Antennas; packages;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2012.2186101
Filename
6168213
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