• DocumentCode
    1467755
  • Title

    PCF-Based Fabry–Pérot Interferometric Sensor for Strain Measurement at High Temperatures

  • Author

    Deng, Ming ; Tang, Chang-Ping ; Zhu, Tao ; Rao, Yun-Jiang

  • Author_Institution
    Key Lab. of Optoelectron. Technol. & Syst. (Educ. Minist. of China), Chongqing Univ., Chongqing, China
  • Volume
    23
  • Issue
    11
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    700
  • Lastpage
    702
  • Abstract
    We report a simple and robust all-fiber in-line Fabry-Pérot interferometer (FPI) with an air bubble cavity, which is fabricated by directly splicing a multimode photonic crystal fiber (MPCF) to a conventional single-mode fiber with a commercialized fusion splicer. The air microbubble inserted between the two fibers has two smooth glass-air interfaces separated by a distance L as two reflective mirrors of the FPI. Due to the big air holes in the cladding of MPCF and its large numerical aperture, this device has higher signal-to-noise ratio and fringe contrast than that of the FPI based on hollow-core photonic crystal fiber. Experimental results show that the FPI can be used to measure strain in the range of 0 ~ 1850 με at high temperatures of up to 750°C. Therefore, such an FPI sensor may find important applications in the aeronautics or metallurgy areas.
  • Keywords
    Fabry-Perot interferometers; fibre optic sensors; holey fibres; optical fibre fabrication; photonic crystals; splicing; strain measurement; Fabry-Perot interferometric sensor; air bubble cavity; all fiber in-line Fabry-Perot interferometer; fusion splicer; glass-air interfaces; high temperature strain measurement; multimode photonic crystal fiber splicing; single mode fiber; Cavity resonators; Optical fiber sensors; Optical fibers; Strain; Temperature measurement; Temperature sensors; High temperature; optical fiber Fabry–Pérot interferometer (FPI); photonic crystal fiber; strain measurement;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2011.2124452
  • Filename
    5727908