DocumentCode
1467960
Title
Degradation in InAs–AlSb HEMTs Under Hot-Carrier Stress
Author
DasGupta, Sandeepan ; Shen, Xiao ; Schrimpf, Ronald D. ; Reed, Robert A. ; Pantelides, Sokrates T. ; Fleetwood, Dan M. ; Bergman, J.I. ; Brar, B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Volume
58
Issue
5
fYear
2011
fDate
5/1/2011 12:00:00 AM
Firstpage
1499
Lastpage
1507
Abstract
InAs-AlSb high-electron mobility transistors stressed with hot carriers may exhibit shifts in the peak transconductance toward more negative gate-voltages. The devices are most degradation prone in operating conditions with high longitudinal (in the direction of IDS) electric fields in the channel. Room-temperature annealing, gate current, and channel-mobility measurements suggest the presence of a metastable defect in the top AlSb layer. Device simulations and first-principles quantum-mechanical calculations are used to investigate the physical nature of the defects responsible for degradation. Metastable configurations of substitutional and interstitial oxygen have charge states and transition energies consistent with the degradation trends.
Keywords
III-V semiconductors; ab initio calculations; aluminium compounds; annealing; carrier mobility; high electron mobility transistors; indium compounds; quantum theory; HEMT; InAs-AlSb; annealing; channel-mobility measurements; electric fields; first-principles quantum-mechanical calculations; gate current; high-electron mobility transistors; hot-carrier stress; metastable configurations; metastable defect; temperature 293 K to 298 K; Degradation; HEMTs; Hot carriers; Logic gates; MODFETs; Stress; Threshold voltage; Aluminium antimonide (AlSb); density functional theory (DFT); high-electron mobility transistor (HEMT); hot-carrier stress; indium arsenide (InAs);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2116157
Filename
5727940
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