DocumentCode
1469739
Title
Percolative Model and Thermodynamic Analysis of Oxygen-Ion-Mediated Resistive Switching
Author
Raghavan, Nagarajan ; Pey, Kin Leong ; Wu, Xing ; Liu, Wenhu ; Bosman, Michel
Author_Institution
Div. of Microelectron., Nanyang Technol. Univ., Singapore, Singapore
Volume
33
Issue
5
fYear
2012
fDate
5/1/2012 12:00:00 AM
Firstpage
712
Lastpage
714
Abstract
We present a statistical percolation model for retention lifetime assessment of resistive switching memory at the high-resistance state and correlate it to the soft breakdown phenomenon in ultrathin gate dielectrics. Electrical characterization in the low-resistance state shows that the location of oxygen-vacancy-based conductive filaments is almost randomly distributed and the trap generation rate across the oxide after reset transition is uniform. The constraints for the range of read voltages in the low and high conduction states, governed by the area of the device and the thermodynamics of oxygen ion transport, are presented.
Keywords
dielectric materials; ions; random-access storage; switching; thermodynamics; electrical characterization; high-resistance state; low-resistance state; oxygen ion transport; oxygen-ion-mediated resistive switching; oxygen-vacancy-based conductive filament; percolative model; reset transition; resistive switching memory; retention lifetime assessment; statistical percolation model; thermodynamic analysis; thermodynamics; trap generation rate; ultrathin gate dielectrics; Dielectrics; Logic gates; Passivation; Reliability; Stress; Switches; Thermodynamics; Oxygen vacancy; percolation model; read voltage; reliability; resistive switching; soft breakdown (SBD);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2012.2187170
Filename
6169944
Link To Document