• DocumentCode
    1469739
  • Title

    Percolative Model and Thermodynamic Analysis of Oxygen-Ion-Mediated Resistive Switching

  • Author

    Raghavan, Nagarajan ; Pey, Kin Leong ; Wu, Xing ; Liu, Wenhu ; Bosman, Michel

  • Author_Institution
    Div. of Microelectron., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    33
  • Issue
    5
  • fYear
    2012
  • fDate
    5/1/2012 12:00:00 AM
  • Firstpage
    712
  • Lastpage
    714
  • Abstract
    We present a statistical percolation model for retention lifetime assessment of resistive switching memory at the high-resistance state and correlate it to the soft breakdown phenomenon in ultrathin gate dielectrics. Electrical characterization in the low-resistance state shows that the location of oxygen-vacancy-based conductive filaments is almost randomly distributed and the trap generation rate across the oxide after reset transition is uniform. The constraints for the range of read voltages in the low and high conduction states, governed by the area of the device and the thermodynamics of oxygen ion transport, are presented.
  • Keywords
    dielectric materials; ions; random-access storage; switching; thermodynamics; electrical characterization; high-resistance state; low-resistance state; oxygen ion transport; oxygen-ion-mediated resistive switching; oxygen-vacancy-based conductive filament; percolative model; reset transition; resistive switching memory; retention lifetime assessment; statistical percolation model; thermodynamic analysis; thermodynamics; trap generation rate; ultrathin gate dielectrics; Dielectrics; Logic gates; Passivation; Reliability; Stress; Switches; Thermodynamics; Oxygen vacancy; percolation model; read voltage; reliability; resistive switching; soft breakdown (SBD);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2187170
  • Filename
    6169944