Title :
Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics
Author :
Kota, Krishna ; Hidalgo, Pablo ; Joshi, Yogendra ; Glezer, Ari
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
5/1/2012 12:00:00 AM
Abstract :
This paper focuses on the design and parametric numerical study of a hybrid heat sink combining a liquid thermal interface with an array of synthetic jet actuators for 3-D chip stack cooling. The air-side heat sink exploits enhanced localized heat transfer achieved via a central array of synthetic jet actuators. The key focus of this paper is the numerical simulation of the dielectric liquid interface used to efficiently transmit the heat from the high-power 3-D stacked electronics to the hybrid heat sink base. The coupled natural convection in the fluid and conduction in solid spreaders sandwiched between the tiers of the stack form a novel efficient, passive, and scalable thermal management solution for 3-D stacked die structures. It is shown that this heat sink with a footprint of 76-mm square × 51-mm height can dissipate a total of 41 W of heat/power from the stack for a 44°C average chip temperature rise above ambient (an Rja of ~ 1.06 K/W obtained passively).
Keywords :
cooling; heat sinks; 3D chip stack cooling; 3D stacked die structures; air-side heat sink; central array; cooling 3D stacked electronics; coupled natural convection; dielectric liquid interface; high power 3D stacked electronics; hybrid heat sink base; hybrid liquid immersion; liquid thermal interface; localized heat transfer; numerical simulation; parametric numerical study; scalable thermal management solution; solid spreaders; synthetic jet actuators; synthetic jet heat sink; Heat sinks; Heat transfer; Resistance heating; Solids; 3-D electronics; conduction; heat spreaders; immersion cooling; synthetic jets;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2186452