• DocumentCode
    1471144
  • Title

    Special issue on materials, processing and reliability of 3D interconnects

  • Volume
    11
  • Issue
    1
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    204
  • Lastpage
    204
  • Abstract
    Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2011.2126750
  • Filename
    5730000
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1471144