DocumentCode :
1471921
Title :
Electronic Packaging Materials Science IX (Book Review)
Author :
Shea, John
Volume :
15
Issue :
1
fYear :
1999
Firstpage :
35
Lastpage :
35
Keywords :
Book reviews; Conducting materials; Electronic packaging thermal management; Electronics packaging; Materials science and technology; Materials testing; Metrology; Paper technology; Polymer films; Spreadsheet programs;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.1999.744589
Filename :
744589
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1471921
