• DocumentCode
    1472475
  • Title

    Surface Integral Equation Formulation for Inductance Extraction in 3-D Interconnects

  • Author

    Al-Qedra, Mohammed ; Aronsson, Jonatan ; Okhmatovski, Vladimir

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Manitoba, Winnipeg, MB, Canada
  • Volume
    20
  • Issue
    5
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    250
  • Lastpage
    252
  • Abstract
    A novel surface integral equation based algorithm is proposed for accurate inductance and resistance extraction in 3-D interconnects. The surface integral equation is obtained by using the skin-effect cross-sectional approximation of the volumetric current density in the traditional volumetric integral equation. The method allows for substantial reduction of computational complexity in the pertinent boundary-element formulation compared with widely adopted volumetric models. For a fixed number of samples per skin-depth establishing a desired accuracy of extraction, the number of degrees of freedom in the proposed discretized problem scales with frequency ?? as O(????), as opposed to O(??) exhibited by the volumetric models. The accuracy of extraction is shown to be maintained from dc to the limit of magneto-quasistatic approximation.
  • Keywords
    boundary-elements methods; current density; integral equations; interconnections; lumped parameter networks; 3D interconnects; adopted volumetric models; boundary-element formulation; computational complexity; discretized problem scales; inductance extraction; magneto-quasistatic approximation; resistance extraction; skin depth; skin-effect cross-sectional approximation; surface integral equation based algorithm; surface integral equation formulation; volumetric current density; volumetric integral equation; Conductor; magneto-quasistatics; resistance/inductance (RL) extraction; skin-effect; surface impedance;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2010.2045577
  • Filename
    5447710