Title :
High-Efficiency Class E/F Lumped and Transmission-Line Power Amplifiers
Author :
Grebennikov, Andrei
Author_Institution :
Bell Labs., Alcatel-Lucent, Dublin, Ireland
fDate :
6/1/2011 12:00:00 AM
Abstract :
The theoretical analysis of a single-ended Class E/F n mode with explicit derivation of the idealized optimum voltage and current waveforms and load-network parameters with their verification by time- and frequency-domain simulations for a particular case of Class E/F3 mode with a 50% duty cycle are presented. The ideal collector voltage and current waveforms for driving signals with 50% duty cycles demonstrate a possibility of 100% efficiency without overlapping between each other. Two examples of the Class E/F3 GaN HEMT power amplifiers, one with lumped elements at operating frequency of 430 MHz and the other with transmission-line elements at operating frequency of 2.14 GHz, are described and analyzed based on the simulation results. The test board with implemented transmission-line Class E/F3 GaN HEMT power amplifier has been measured and high-performance results with the output power of 40 dBm, drain efficiency of 76%, power-added efficiency of 73.1%, and power gain of 14.3 dB were achieved at operating frequency of 2.14 GHz.
Keywords :
frequency-domain analysis; gallium compounds; high electron mobility transistors; power amplifiers; time-domain analysis; transmission lines; GaN HEMT power amplifier; current waveform; drain efficiency; frequency 2.14 GHz; frequency 430 MHz; frequency-domain simulation; gain 14.3 dB; high-efficiency class E/F mode; load-network parameter; lumped element; power gain; power-added efficiency; time-domain simulation; transmission-line power amplifier; voltage waveform; Capacitance; Harmonic analysis; Load modeling; RLC circuits; Resistance; Switches; Switching circuits; Circuit design; GaN HEMT; RF power amplifier; efficiency; harmonic-balance technique; resonant circuit; switch; time-domain analysis; transmission line;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2011.2114672