• DocumentCode
    1473497
  • Title

    An efficient solver for the three-dimensional capacitance of the interconnects in high speed digital circuit by the multiresolution method of moments

  • Author

    Zheng, Ji ; Li, Zheng-Fan ; Qian, Xiao-Ning

  • Author_Institution
    Dept. of Electron. Eng., Shanghai Jiaotong Univ., China
  • Volume
    22
  • Issue
    1
  • fYear
    1999
  • fDate
    2/1/1999 12:00:00 AM
  • Firstpage
    9
  • Lastpage
    15
  • Abstract
    The computation of the equivalent capacitances for three-dimensional (3-D) interconnects features large memory usage and long computing time. In this paper, a matrix sparsification approach based on multiresolution representation is applied with the method of moments (MoM) to calculate 3-D capacitances of interconnects in a layered media. Instead of direct expansion of the charge distribution by the orthogonal wavelet basis functions, the large full matrix resulting from discretization of the integral equations is taken as a discrete image and sparsified by two-dimensional (2-D) multiresolution representations. The inverse of the obtained sparse matrix is efficiently implemented by Schultz´s iterative approach. Several numerical examples are given and the results obtained show that the proposed method significantly sparsifies the matrix equation and the capacitance parameters computed by the matrix equation with high sparsity agree well with the results of other reports and those computed by an established capacitance extractor FASTCAP
  • Keywords
    capacitance; digital integrated circuits; high-speed integrated circuits; integral equations; integrated circuit design; integrated circuit interconnections; iterative methods; sparse matrices; Schultz´s iterative approach; capacitance parameters; equivalent capacitances; high speed digital circuit; integral equations; layered media; matrix sparsification approach; multiresolution method of moments; multiresolution representations; three-dimensional capacitance; Electromagnetic analysis; Integral equations; Integrated circuit interconnections; Moment methods; Nonhomogeneous media; Packaging; Parasitic capacitance; Physics computing; Signal resolution; Sparse matrices;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.746537
  • Filename
    746537