High frequency loss and electromagnetic field distribution for striplines and microstrips [MCM packages]

Author

Lo, H. Louis ; Kauffman, J. Frank ; Franzon, Paul D.

Author_Institution

Tyco Submarine Syst. Ltd., Holmdel, NJ, USA

Volume

22

Issue

1

fYear

1999

fDate

2/1/1999 12:00:00 AM

Firstpage

16

Lastpage

25

Abstract

A new three-component measured equation of invariance (MEI) boundary condition is developed and applied to the hybrid edge/nodal vector finite element method. The electric field distribution on the cross section of various lossy transmission lines is calculated. The propagation constant of a lossy transmission line with coated conductor strip is also calculated. The three-component MEI boundary condition simulates the field distribution on the artificial boundary for electromagnetic field excited by the surface charge density and the three vector components of the electric current density. Numerical experiments are performed to test the method by comparing calculated transmission loss with the measured data

Keywords

current density; electromagnetic fields; finite element analysis; integrated circuit packaging; invariance; losses; microstrip lines; multichip modules; strip lines; artificial boundary; boundary condition; coated conductor strip; electric current density; electromagnetic field distribution; high frequency loss; hybrid edge/nodal vector finite element method; lossy transmission lines; microstrips; propagation constant; striplines; surface charge density; three-component measured equation of invariance; transmission loss; Boundary conditions; Electromagnetic fields; Electromagnetic measurements; Equations; Finite element methods; Frequency; Magnetic losses; Propagation constant; Propagation losses; Transmission line measurements;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.746538

Filename

746538