DocumentCode
1473596
Title
Application of nonlinear methods in tracking failure test of printed circuit boards under reduced pressure
Author
Du, B.X. ; Gu, L. ; Liu, Yong
Author_Institution
Dept. of Electr. Eng., Tianjin Univ., Tianjin, China
Volume
17
Issue
2
fYear
2010
fDate
4/1/2010 12:00:00 AM
Firstpage
548
Lastpage
554
Abstract
In high-altitude regions, printed circuit boards are affected by both low pressure and contamination, which may lead to discharge and even the failure of electrical devices. From the viewpoint of safety and reliability, it is necessary to investigate the effects of the pressure on tracking failure of contaminated printed circuit boards. However, the tracking failure is a nonlinear and indeterminate process which results in the dispersity of experimental results. This paper proposes two nonlinear methods, including fractal dimension of tracking pattern and recurrence plots of discharge current, to analyze the phenomena and mechanism of tracking failure under reduced pressures. The experiments were carried out in a decompression chamber, with the pressure reducing from 102.74 kPa to 0.6 kPa. The test sample was made by printing a pair of copper foil electrodes onto a glass-cloth-base epoxy resin laminate with the insulation distance from 500 ¿m to 100 ¿m. The contamination was simulated by a droplet of NH4Cl electrolyte with the resistivity of 4 ¿·m. The time to tracking failure, the fractal dimension of tracking patterns and the recurrent plot of discharge currents were obtained as functions of the pressure and the insulation distance. The results reveal that the nonlinear methods can give a good identification of the surface morphology and the underlying mechanism in the tracking test. Effects of the pressure and insulation distance on the tracking failure were quantitatively reflected with the fractal dimension of tracking patterns and the recurrent plot of discharge currents.
Keywords
electrodes; failure analysis; insulation; printed circuit testing; resins; surface contamination; surface morphology; NH4Cl electrolyte; contamination; copper foil electrode; decompression chamber; fractal dimension; glass-cloth-base epoxy resin laminate; insulation distance; nonlinear method; printed circuit board; recurrence plot; reduced pressure; surface morphology; tracking failure test; tracking pattern; Circuit testing; Contamination; Failure analysis; Fractals; Insulation life; Insulation testing; Pattern analysis; Printed circuits; Printing; Safety;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2010.5448111
Filename
5448111
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