Title :
Mapping and repairing embedded-memory defects
Author :
Youngs, Lynn ; Paramanandam, Siva
Author_Institution :
Texas Instrum. Inc., Stafford, TX, USA
Abstract :
Yield is perhaps the single most important measure of manufacturing efficiency for large integrated circuits. To reduce the time to volume production and accelerate continuous yield improvement, the manufacturing flow of the UltraSparc microprocessor includes memory test as well as defect mapping and repair
Keywords :
computer testing; integrated circuit testing; integrated circuit yield; memory architecture; microprocessor chips; UltraSparc microprocessor; continuous yield improvement; defect mapping; embedded memory defects; large integrated circuits; manufacturing efficiency; manufacturing flow; memory test; Circuit faults; Circuit testing; Integrated circuit yield; Logic testing; Manufacturing; Microprocessors; Production; Random access memory; Read-write memory; Yield estimation;
Journal_Title :
Design & Test of Computers, IEEE
