DocumentCode
1474911
Title
Demonstration of chip-to-chip propagation of single flux quantum pulses
Author
Maezawa, Masaaki ; Yamamori, Hirotake ; Shoji, Akira
Author_Institution
Electrotech. Lab., Ibaraki, Japan
Volume
11
Issue
1
fYear
2001
fDate
3/1/2001 12:00:00 AM
Firstpage
337
Lastpage
340
Abstract
We report experimental results on chip-to-chip transfer of single-flux-quantum (SFQ) pulses using an active multichip module (MCM). Josephson transmitters and receivers are integrated on both a chip and an MCM substrate. An MCM consisting of a 4.8-mm chip and an 8.2-mm MCM substrate was fabricated using a 1.6-kA/cm2 Nb-trilayer process and a solder-bumped flip-chip bonding technology. The correct operation of the circuit was confirmed by low-speed testing. Bit-error rate (BER) of the circuit was measured down to 10-5, and extrapolation of the error-function fits suggested a very small BER, lower than 10-200, at the optimum bias point. Experimental margins on the bias voltage were as large as ±34%
Keywords
flip-chip devices; multichip modules; superconducting logic circuits; 4.8 mm; 8.2 mm; Josephson receivers; Josephson transmitters; MCM substrate; Nb-AlO-Nb; Nb-trilayer process; active multichip module; bias voltage; bit-error rate; chip-to-chip propagation; error-function; low-speed testing; single flux quantum pulses; solder-bumped flip-chip bonding technology; Bit error rate; Bonding; Broadband communication; Circuit testing; Connectors; Inductance; Multichip modules; Power transmission lines; Transmitters; Voltage;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.919351
Filename
919351
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