• DocumentCode
    1474911
  • Title

    Demonstration of chip-to-chip propagation of single flux quantum pulses

  • Author

    Maezawa, Masaaki ; Yamamori, Hirotake ; Shoji, Akira

  • Author_Institution
    Electrotech. Lab., Ibaraki, Japan
  • Volume
    11
  • Issue
    1
  • fYear
    2001
  • fDate
    3/1/2001 12:00:00 AM
  • Firstpage
    337
  • Lastpage
    340
  • Abstract
    We report experimental results on chip-to-chip transfer of single-flux-quantum (SFQ) pulses using an active multichip module (MCM). Josephson transmitters and receivers are integrated on both a chip and an MCM substrate. An MCM consisting of a 4.8-mm chip and an 8.2-mm MCM substrate was fabricated using a 1.6-kA/cm2 Nb-trilayer process and a solder-bumped flip-chip bonding technology. The correct operation of the circuit was confirmed by low-speed testing. Bit-error rate (BER) of the circuit was measured down to 10-5, and extrapolation of the error-function fits suggested a very small BER, lower than 10-200, at the optimum bias point. Experimental margins on the bias voltage were as large as ±34%
  • Keywords
    flip-chip devices; multichip modules; superconducting logic circuits; 4.8 mm; 8.2 mm; Josephson receivers; Josephson transmitters; MCM substrate; Nb-AlO-Nb; Nb-trilayer process; active multichip module; bias voltage; bit-error rate; chip-to-chip propagation; error-function; low-speed testing; single flux quantum pulses; solder-bumped flip-chip bonding technology; Bit error rate; Bonding; Broadband communication; Circuit testing; Connectors; Inductance; Multichip modules; Power transmission lines; Transmitters; Voltage;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.919351
  • Filename
    919351