Title :
Time Multiplexed VLSI Architecture for Real-Time Barrel Distortion Correction in Video-Endoscopic Images
Author :
Chen, Shih-Lun ; Huang, Hong-Yi ; Luo, Ching-Hsing
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
A low-cost very large scale integration (VLSI) implementation of real-time correction of barrel distortion for video-endoscopic images is presented in this paper. The correcting mathematical model is based on least-squares estimation. To decrease the computing complexity, we use an odd-order polynomial to approximate the back-mapping expansion polynomial. By algebraic transformation, the approximated polynomial becomes a monomial form which can be solved by Hornor´s algorithm. With the iterative characteristic of Hornor´s algorithm, the hardware cost and memory requirement can be conserved by time multiplexed design. In addition, a simplified architecture of the linear interpolation is used to reduce more computing resource and silicon area. The VLSI architecture of this paper contains 13.9-K gates by using a 0.18 μm CMOS process. Compared with some existing distortion correction techniques, this paper reduces at least 69% hardware cost and 75% memory requirement.
Keywords :
CMOS integrated circuits; endoscopes; interpolation; least squares approximations; medical image processing; multiplexing; polynomial approximation; video signal processing; CMOS process; Hornor algorithm; algebraic transformation; back mapping expansion polynomial; iterative characteristic; least squares estimation; linear interpolation; mathematical model; odd order polynomial; real time barrel distortion correction; size 0.18 mum; time multiplexed VLSI architecture; video endoscopic images; Algorithm design and analysis; Computer architecture; Hardware; Interpolation; Pixel; Polynomials; Very large scale integration; Barrel distortion correction; hornor´s algorithm; least-squares estimation; time multiplexed; video-endoscopic image;
Journal_Title :
Circuits and Systems for Video Technology, IEEE Transactions on
DOI :
10.1109/TCSVT.2011.2129850