DocumentCode
1475561
Title
Multilayer Global Routing With Via and Wire Capacity Considerations
Author
Hsu, Chin-Hsiung ; Chen, Huang-Yu ; Chang, Yao-Wen
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ. (NTU), Taipei, Taiwan
Volume
29
Issue
5
fYear
2010
fDate
5/1/2010 12:00:00 AM
Firstpage
685
Lastpage
696
Abstract
Global routing for modern large-scale circuit designs has attracted much attention in the recent literature. Most of the state-of-the-art academic global routers just work on a simplified routing congestion model that ignores the essential via capacity for routing through multiple metal layers. Such a simplified model would easily cause fatal routability problems in subsequent detailed routing. To remedy this deficiency, a more effective congestion metric that considers both the in-tile nets and the residual via capacity for global routing is presented. Experimental results show that our global router can achieve very high-quality routing solutions with more reasonable via usage.
Keywords
integrated circuit design; network routing; large-scale circuit designs; multilayer global routing; multiple metal layers; residual via capacity; routing congestion model; Circuit synthesis; Design for manufacture; Integrated circuit manufacture; Integrated circuit technology; Integrated circuit yield; Large-scale systems; Nonhomogeneous media; Routing; Semiconductor device manufacture; Wire; Congestion; global routing; layout; physical design;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2010.2043575
Filename
5452098
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