Title :
High-Impedance-Surface-Based Antenna With Two Orthogonal Radiating Modes
Author :
Karilainen, Antti O. ; Vehmas, Joni ; Luukkonen, Olli ; Tretyakov, Sergei A.
Author_Institution :
Dept. of Radio Sci. & Eng., Aalto Univ., Aalto, Finland
fDate :
7/3/1905 12:00:00 AM
Abstract :
High-impedance surfaces (HISs) have been used as artificial magnetic conductors for low-profile dipole antennas. Usually, the desired operation has been designed using the phase-reflection simulations for normal incidence. Here, we study the properties of a mushroom-type HIS using reflection-phase calculations for oblique incidence and find two orthogonal resonant modes. An antenna based on a finite-sized HIS is designed to utilize both of these modes. Measurement results are presented for the antenna, and we report two separate modes with asymmetric radiation patterns. The first mode provides a dipole-like radiation pattern, and the second one a broadside pattern. Furthermore, the second mode can be coupled to the antenna with a proper coupling element in order to obtain a wide bandwidth. Both of the modes can be matched to 50-Ω coaxial cables, and good isolation levels between the ports are seen due to the orthogonality of the modes in the HIS.
Keywords :
antenna radiation patterns; coaxial cables; conductors (electric); dipole antennas; frequency selective surfaces; artificial magnetic conductors; asymmetric radiation patterns; broadside pattern; coaxial cables; coupling element; dipole-like radiation pattern; frequency selective surfaces; high-impedance-surface-based antenna; low-profile dipole antennas; mushroom-type HIS; oblique incidence; orthogonal radiating modes; orthogonal resonant modes; phase-reflection simulations; resistance 50 ohm; Antenna measurements; Antenna radiation patterns; Dipole antennas; Plasma measurements; Plasmas; Resonant frequency; Antenna radiation patterns; frequency selective surfaces; microstrip antennas; multifrequency antennas;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2011.2130508