• DocumentCode
    1476244
  • Title

    Vibration Transmission Analysis on a Superconducting Seismic Isolation Device With PM and Copper Plate Systems

  • Author

    Sasaki, S. ; Shimada, K. ; Katana, T. ; Miyagi, D. ; Tsuda, Makoto ; Hamajima, T. ; Kawai, N. ; Yasui, K.

  • Author_Institution
    Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
  • Volume
    22
  • Issue
    3
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    3600804
  • Lastpage
    3600804
  • Abstract
    We have devised a magnetic levitation type superconducting seismic isolation device using pinning effect of HTS bulk and investigated the characteristics of vibration transmission and damping in a model device with two types of permanent magnet (PM) systems with copper plates; the one was for stable stationary levitation named “PM-PM system” and the other was for improving damping effect named “vibration absorbing system (VAS)”. To clarify the electromagnetic behaviors of these systems, we calculated the distributions of eddy current and magnetic force within the copper plates during a horizontal vibration using a numerical simulation code based on the three-dimensional finite element method (3D-FEM) analysis. As the results, the vibration transmission was reduced due to the Lorenz force generated in the copper plate.
  • Keywords
    copper; damping; eddy currents; finite element analysis; magnetic forces; magnetic levitation; permanent magnets; superconducting devices; vibration isolation; 3D-FEM analysis; HTS bulk; Lorenz force; PM-PM system; copper plate systems; damping effect; eddy current distributions; electromagnetic behaviors; magnetic force; magnetic levitation; numerical simulation code; permanent magnet systems; superconducting seismic isolation devices; three-dimensional finite element method analysis; vibration absorbing system; vibration transmission analysis; Damping effect; HTS bulk; seismic isolation device; vibration transmission;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2012.2186429
  • Filename
    6172655