DocumentCode :
1477445
Title :
Mobility and Velocity Enhancement Effects of High Uniaxial Stress on Si (100) and (110) Substrates for Short-Channel pFETs
Author :
Mayuzumi, Satoru ; Yamakawa, Shinya ; Kosemura, Daisuke ; Takei, Munehisa ; Nagata, Kohki ; Akamatsu, Hiroaki ; Wakabayashi, Hitoshi ; Amari, Koichi ; Tateshita, Yasushi ; Tsukamoto, Masanori ; Ohno, Terukazu ; Ogura, Atsushi ; Nagashima, Naoki
Author_Institution :
Semicond. Bus. Group, Sony Corp., Atsugi, Japan
Volume :
57
Issue :
6
fYear :
2010
fDate :
6/1/2010 12:00:00 AM
Firstpage :
1295
Lastpage :
1300
Abstract :
An experimental study of mobility and velocity enhancement effects is reported for highly strained short-channel p-channel field-effect transistors (pFETs) using a damascene-gate process on Si (100) and (110) substrates. The relationship between the mobility and the saturation velocity of hole under a compressive stress over 2.0 GPa is discussed. The local channel stress of 2.4 GPa is successfully measured with ultraviolet-Raman spectroscopy for the 30-nm-gate-length device with top-cut compressive-stress SiN liner and embedded SiGe. Mobility and saturation-velocity enhancements of (100) substrate are larger than those of (110) under the high channel stress. In consequence, the saturation current on (100) is larger than that on (110) for the pFETs with higher channel stress and shorter gate length. Moreover, the large enhancement rate of saturation velocity to mobility by the uniaxial stress suggests high injection velocity for the pFETs with the stressors since the high channel stress is induced near the potential peak of the source by using the damascene-gate technology.
Keywords :
Ge-Si alloys; Raman spectra; field effect transistors; silicon compounds; ultraviolet spectra; wide band gap semiconductors; SiGe; SiN; damascene-gate process; damascene-gate technology; high channel stress; high injection velocity; high uniaxial stress; highly strained short-channel p-channel field-effect transistors; mobility enhancement effects; pressure 2.4 GPa; saturation-velocity enhancements; short-channel pFET; size 30 nm; top-cut compressive stress; ultraviolet-Raman spectroscopy; velocity enhancement effects; Capacitive sensors; Compressive stress; Diffraction; FETs; Germanium silicon alloys; Silicon compounds; Silicon germanium; Spectroscopy; Stress measurement; Substrates; Compressive-stress SiN liner (c-SL); Si (100); Si (110); damascene gate; embedded SiGe (eSiGe); gate last; gate length; hole mobility; nanobeam diffraction (NBD); saturation velocity; strain; ultraviolet (UV)-Raman spectroscopy; uniaxial stress;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2045703
Filename :
5453060
Link To Document :
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