High-frequency measurement of integrated circuit components

A jig for extending a 50 ¿ high frequency measuring system to the pads of a chip device is described. No permanent wire bonds are used and contact may be made with normal aluminium pads. The electrical characterization of the jig up to 1 GHz has been carried out using a General Radio transfer function and immittance bridge, and Y-parameter measurements on typical chip devices have been obtained. The results are applicable to the design of integrated circuits and to device modelling.