DocumentCode
1478101
Title
Study of interface state density and effective oxide charge in post-metallization annealed SiO2-SiC structures
Author
Campi, John ; Shi, Yan ; Luo, Yanbin ; Yan, Feng ; Zhao, Jian H.
Author_Institution
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
Volume
46
Issue
3
fYear
1999
fDate
3/1/1999 12:00:00 AM
Firstpage
511
Lastpage
519
Abstract
A systematic study of post-metallization annealing (PMA) effect on the quality of thermal SiO2 on p-type 6H- and 4H-SiC has been carried out. A simultaneous quasi-static hi-lo frequency capacitance-voltage method has been employed to measure the total effective oxide charge (Neff) and interface state density (D it). To ensure accurate results, Dit was measured at 350°C which, depending on the hole capture cross sections, should enable the measurement of interface states located in the band gap as deep as 1.3-1.5 eV from the valence band edge. The dependence of Neff and Dit on annealing temperature and ambient as well as the effect of thermal and sputtered gate metal on the oxide quality are reported. It is shown that Neff values close to the detection limit due to the uncertainty in SiC electron affinities and Dit values below 1×1011 cm-2/eV deep in the band gap can be reproducibly obtained for both p-type 6H- and 4H-SiC
Keywords
MOSFET; annealing; electron affinity; hole traps; interface states; semiconductor device measurement; semiconductor-insulator boundaries; silicon compounds; wide band gap semiconductors; 350 C; SiO2-SiC; SiO2/SiC structures; annealing temperature; band gap; capacitance-voltage method; effective oxide charge; hole capture cross sections; interface state density; oxide quality; p-type 4H-SiC; p-type 6H-SiC; post-metallization annealed structures; quasi-static hi-lo frequency C-V method; sputtered gate metal; thermal SiO2; Annealing; Capacitance measurement; Capacitance-voltage characteristics; Charge measurement; Current measurement; Density measurement; Frequency measurement; Interface states; Photonic band gap; Temperature dependence;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.748870
Filename
748870
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