• DocumentCode
    1478144
  • Title

    Influence of microstructural variation on the electrical properties of SiC microthermistors

  • Author

    Terashige, Takashi ; Okano, Kazuo

  • Author_Institution
    Dept. of Electr. Eng., Polytech. Univ., Kanagawa, Japan
  • Volume
    46
  • Issue
    3
  • fYear
    1999
  • fDate
    3/1/1999 12:00:00 AM
  • Firstpage
    555
  • Lastpage
    560
  • Abstract
    The effects of the microstructural nonuniformity on the variations in the electrical properties of SiC ceramic were estimated quantitatively through simulations in order to produce microthermistors with the material. In these simulations, the grain size, the trap concentration at the grain boundary and the doping level in the grain were considered as the various microstructural nonuniformities. The device size was also taken into account as a parameter. The boundary potential model and the energy band model were used to express the electrical characteristics of the grain boundaries in the simulations. It is pointed out that those nonuniform microstructures greatly influence the electrical conductivity and the sensitivity of the SiC ceramic microthermistor. These phenomena are explained by the percolation theory. The tolerance of microstructural variation in the production of the ceramic is also discussed. It is revealed that the percolation threshold has the possibility to be used as an index of the acceptable microstructural tolerances
  • Keywords
    ceramics; electrical conductivity; grain boundaries; grain size; high-temperature electronics; percolation; semiconductor materials; silicon compounds; thermistors; SiC; SiC ceramic microthermistor; boundary potential model; device size; doping level; electrical conductivity; energy band model; grain boundary trap concentration; grain size; microstructure; numerical simulation; percolation; polycrystalline semiconductor; Ceramics; Conductivity; Doping; Electric variables; Grain boundaries; Grain size; Microstructure; Production; Semiconductor process modeling; Silicon carbide;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.748876
  • Filename
    748876