Title :
Biaxially textured Ni-alloy tapes as substrates for buffer and Y-Ba-Cu-O film growth
Author :
De Boer, Bemd ; Reger, Norman ; Fernandez G.R., L. ; Eickemeyer, Jörg ; Berberich, Paul ; Prusseit, Werner ; Holzapfel, Bemhard ; Schultz, Ludwig
Author_Institution :
Inst. of Solid State & Mater. Res., Dresden, Germany
fDate :
3/1/2001 12:00:00 AM
Abstract :
Highly cube ({001}⟨100⟩) textured Ni- and Ni-alloy tapes are produced by heavy cold rolling and recrystallisation annealing. Due to impurities in Ni, abnormal grain growth destroying the cube texture often occurs at temperatures above 600°C. This could be prevented by alloying Ni with 0.1 at.% of different elements each leading to a texture improvement with increasing annealing temperature. YBa2 Cu3O7-δ-films deposited on these tapes reach critical current densities up to 0.5×106 A/cm2. Also Ni-Cr and Ni-V were successfully processed to highly cube textured tapes. Their magnetic and mechanical properties were characterized. Ni-13 at.% Cr and Ni-11 at.% V have a Curie temperature below 77 K. Their yield strength is three times higher than that of unalloyed Ni
Keywords :
Curie temperature; barium compounds; chromium alloys; cold rolling; critical current density (superconductivity); ferromagnetic materials; high-temperature superconductors; nickel alloys; recrystallisation annealing; superconducting tapes; superconducting thin films; surface texture; vanadium alloys; yield strength; yttrium compounds; 600 C; 77 K; Curie temperature; Ni-Cr; Ni-V; NiCr; NiV; Y-Ba-Cu-O film growth; YBa2Cu3O7-δ-films; YBa2Cu3O7; abnormal grain growth; annealing temperature; biaxially textured Ni-alloy tapes; buffer; critical current densities; cube texture; heavy cold rolling; impurities; magnetic properties; mechanical properties; recrystallisation annealing; substrates; yield strength; Alloying; Annealing; Impurities; Magnetic properties; Mechanical factors; Nickel; Substrates; Superconducting magnets; Temperature; Yttrium barium copper oxide;
Journal_Title :
Applied Superconductivity, IEEE Transactions on