• DocumentCode
    1478165
  • Title

    Photoluminescence from Er-implanted polycrystalline 3C SiC

  • Author

    Uekusa, Shin-ichiro ; Awahara, Kazuhiko ; Kumagai, Masao

  • Author_Institution
    Sch. of Sci. & Technol., Meiji Univ., Kanagawa, Japan
  • Volume
    46
  • Issue
    3
  • fYear
    1999
  • fDate
    3/1/1999 12:00:00 AM
  • Firstpage
    572
  • Lastpage
    576
  • Abstract
    Erbium (Er) ions were implanted into polycrystalline 3C silicon carbide (SiC), and were characterized by photoluminescence (PL) measurements and Rutherford backscattering spectrometry (RBS) channeling analysis. The optimum annealing temperature and Er dose for SiC:Er were 1600°C and 3×1013 cm-2, respectively. PL intensity decreased at 1700°C, and the bandedge luminescence changed in relation to the luminescence of Er3+. The decrease in the PL intensity of Er3+ may be due to the sublimation of Si atoms and the decrease in excitation volume of PL. The PL intensity of SiC:Er,O (SiC:Er coimplanted with oxygen) was twice as strong as that of SiC:Er, whereas no other PL peaks were observed. Thermal quenching of the luminescence of Er3+ was suppressed by using SiC with a wide band gap as a host material and the Er3+-PL was observed at room temperature (RT). Our present results suggest that the transfer of the recombination energy of electron-hole pairs generated in SiC to the Er-4f-shell via the Auger effect causes the luminescence of Er3+ in SiC:Er
  • Keywords
    Auger effect; Rutherford backscattering; annealing; channelling; electron-hole recombination; erbium; photoluminescence; silicon compounds; spectral line intensity; wide band gap semiconductors; 1600 C; 1700 C; 293 K; Auger effect; RBS; Rutherford backscattering spectrometry; SiC:Er; bandedge luminescence; channeling analysis; electron-hole pairs; line intensity; optimum annealing temperature; photoluminescence; polycrystalline 3C SiC; recombination energy; room temperature; wide band gap; Annealing; Backscatter; Erbium; Luminescence; Photoluminescence; Silicon carbide; Spectroscopy; Temperature; Thermal quenching; Wideband;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.748879
  • Filename
    748879