DocumentCode :
1478165
Title :
Photoluminescence from Er-implanted polycrystalline 3C SiC
Author :
Uekusa, Shin-ichiro ; Awahara, Kazuhiko ; Kumagai, Masao
Author_Institution :
Sch. of Sci. & Technol., Meiji Univ., Kanagawa, Japan
Volume :
46
Issue :
3
fYear :
1999
fDate :
3/1/1999 12:00:00 AM
Firstpage :
572
Lastpage :
576
Abstract :
Erbium (Er) ions were implanted into polycrystalline 3C silicon carbide (SiC), and were characterized by photoluminescence (PL) measurements and Rutherford backscattering spectrometry (RBS) channeling analysis. The optimum annealing temperature and Er dose for SiC:Er were 1600°C and 3×1013 cm-2, respectively. PL intensity decreased at 1700°C, and the bandedge luminescence changed in relation to the luminescence of Er3+. The decrease in the PL intensity of Er3+ may be due to the sublimation of Si atoms and the decrease in excitation volume of PL. The PL intensity of SiC:Er,O (SiC:Er coimplanted with oxygen) was twice as strong as that of SiC:Er, whereas no other PL peaks were observed. Thermal quenching of the luminescence of Er3+ was suppressed by using SiC with a wide band gap as a host material and the Er3+-PL was observed at room temperature (RT). Our present results suggest that the transfer of the recombination energy of electron-hole pairs generated in SiC to the Er-4f-shell via the Auger effect causes the luminescence of Er3+ in SiC:Er
Keywords :
Auger effect; Rutherford backscattering; annealing; channelling; electron-hole recombination; erbium; photoluminescence; silicon compounds; spectral line intensity; wide band gap semiconductors; 1600 C; 1700 C; 293 K; Auger effect; RBS; Rutherford backscattering spectrometry; SiC:Er; bandedge luminescence; channeling analysis; electron-hole pairs; line intensity; optimum annealing temperature; photoluminescence; polycrystalline 3C SiC; recombination energy; room temperature; wide band gap; Annealing; Backscatter; Erbium; Luminescence; Photoluminescence; Silicon carbide; Spectroscopy; Temperature; Thermal quenching; Wideband;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.748879
Filename :
748879
Link To Document :
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