DocumentCode :
1478263
Title :
Effect of Substrate Removal on the Optoelectronic Properties of GaAs Epitaxial Layers and GaAs/AlGaAs Vertical-Cavity Surface-Emitting Lasers
Author :
Hiruma, Kenji ; Kinoshita, Masao ; Mikawa, Takashi
Author_Institution :
Nippon Telegraph & Telephone Musashino R&D Center, Assoc. of Super-Adv. Electron. Technol., Tokyo, Japan
Volume :
1
Issue :
3
fYear :
2011
fDate :
3/1/2011 12:00:00 AM
Firstpage :
420
Lastpage :
427
Abstract :
We measured the electron Hall mobility of Si-doped GaAs epitaxial layers (ELs) that were flip-chip-bonded onto an alumina mount to investigate how the quality of the thin layer changes before and after GaAs substrate removal. The electron Hall mobilities at room temperature before and after substrate removal were almost unchanged. Photoluminescence spectra after substrate removal exhibited peak wavelengths at 872-874 nm, which were almost equal to those before substrate removal. This indicates that the quality of ELs was maintained after the process. We measured near-field patterns (NFPs) and far-field patterns (FFPs) of GaAs/AlGaAs vertical-cavity surface-emitting lasers with and without a substrate. There was no change in the full-width-at-half-maximum of the NFP or in the FFP for the optical output range of 0.5-1.3 mW. We confirmed that our novel process is useful for optoelectronic packaging.
Keywords :
Hall mobility; flip-chip devices; packaging; photoluminescence; semiconductor lasers; surface emitting lasers; GaAs; GaAs-AlGaAs; electron Hall mobility; epitaxial layers; far-field patterns; flip-chip-bonding; near-field patterns; optoelectronic packaging; photoluminescence; substrate removal; temperature 293 K to 298 K; vertical-cavity surface-emitting lasers; Bonding; Electrodes; Gallium arsenide; Optical imaging; Substrates; Temperature measurement; Vertical cavity surface emitting lasers; Electron Hall mobility; GaAs epitaxial layer; photoluminescence; substrate removal; vertical-cavity surface-emitting laser;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2010.2095270
Filename :
5737774
Link To Document :
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