• DocumentCode
    1478319
  • Title

    Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards

  • Author

    He, Xinbo ; Hubing, Todd ; Ke, Haixin ; Kobayashi, Naoki ; Morishita, Ken ; Harada, Takashi

  • Author_Institution
    Clemson Univ., Clemson, SC, USA
  • Volume
    53
  • Issue
    2
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    475
  • Lastpage
    481
  • Abstract
    When a printed circuit board (PCB) is mounted to a metal chassis, the cavity formed between the circuit board ground and the chassis can resonate at certain frequencies resulting in unintended radiated emissions. The cavity resonances can be effectively suppressed by using conductive mounting posts and adding a resistance in series with the connection between one or more of these mounting posts and the PCB ground plane. This paper derives a simple closed-form expression for determining an optimal series resistance for damping these cavity resonances over a wide range of frequencies. This analysis was done for rectangular boards mounted on four posts located near the corners. A similar analysis could be done to determine the optimal resistance values for other board shapes and mounting post locations. For the four-post configuration, shorting one or more of the posts does not affect the optimum resistance value for the remaining posts.
  • Keywords
    cavity resonators; electric resistance; electromagnetic waves; printed circuits; PCB ground plane; cavity resonance suppression; chassis-mounted printed circuit boards; circuit board ground; conductive mounting posts; electromagnetic radiation; emission reduction; metal chassis; optimal ground post resistance; series resistance; Cavity resonators; Damping; Metals; Printed circuits; Q factor; Resistance; Resonant frequency; Electromagnetic radiation; printed circuit board (PCB); resonance;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2011.2104375
  • Filename
    5737783