DocumentCode :
1478325
Title :
Hybrid Microstrip T-Stub/Defected Ground Structure Cell for Electromagnetic Interference Bandpass Filter Design
Author :
Luo, Xun ; Ma, Jian-Guo ; Li, Er-Ping ; Ma, Kaixue
Author_Institution :
Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume :
53
Issue :
3
fYear :
2011
Firstpage :
717
Lastpage :
725
Abstract :
In this paper, the hybrid microstrip T-stub/defected ground structure (HMT/DGS) cell is presented, which is composed of a microstrip T-stub and an interdigital DGS with the broadside-coupled (BC) transition. Finely adjusted resonance can be achieved by the proposed cell. Meanwhile, strong slow-wave effect is employed by the structure, which leads to wide stopband responses. Based on these HMT/DGS cells, the interdigital-coupled scheme is employed to implement the electromagnetic interference (EMI) bandpass filter with high performance. To verify the aforementioned mechanism, two filters are designed and fabricated. Specifically, the second-order bandpass filter with a fractional bandwidth (FBW) of 14.3% has a 29.1-dB stopband rejection up to 15 f0 (where f0 stands for the passband center frequency). The fourth-order bandpass filter with an FBW of 10.8% demonstrates a 30.1-dB stopband rejection up to 12.1f0. Both types of filters show compact sizes with low insertion losses less than 1.1 dB.
Keywords :
band-pass filters; electromagnetic interference; microstrip filters; broadside-coupled transition; electromagnetic interference bandpass filter design; fourth-order bandpass filter; fractional bandwidth; hybrid microstrip T-stub/defected ground structure cell; insertion loss; interdigital-coupled scheme; second-order bandpass filter; stopband response; Couplings; Current density; Electromagnetic interference; Microstrip; Microstrip filters; Passband; Resonant frequency; Bandpass filter; broadside-coupled (BC) transition; electromagnetic interference (EMI); hybrid microstrip T-stub/defected ground structure (HMT/DGS) cell; interdigital-coupled scheme; wide stopband;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2011.2114667
Filename :
5737784
Link To Document :
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