Abstract :
The composition of thick film pastes, the processes which occur during firing, and the structure of the resulting film are described and problems encountered in the development of these materials are discussed. The methods which have been used to produce conductors with high conductivity and adhesion, resistors with a wide range of value, insulants suitable for multilayer structures, and printed capacitors with the maximum possible capacitance per unit area are outlined, with emphasis on some new developments.
