• DocumentCode
    1479020
  • Title

    Simulation Study of the Layout Technique for P-hit Single-Event Transient Mitigation via the Source Isolation

  • Author

    Chen, Jianjun ; Chen, Shuming ; Liang, Bin ; Liu, Biwei

  • Author_Institution
    Sch. of Comput. Sci., Nat. Univ. of Defense Technol., Changsha, China
  • Volume
    12
  • Issue
    2
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    501
  • Lastpage
    509
  • Abstract
    In this paper, a layout technique for P-hit single-event transient (SET) mitigation via source isolation is studied by way of technology-computer-aided-design numerical simulations. The source-isolation layout design methodology is thoroughly discussed for the combinational standard cell. Based on a 90-nm twin-well CMOS technology, the simulation results indicate that the proposed “radiation hardened by design” (RHBD) technique can significantly reduce SET pulsewidth. The effects of the ion strike angles and strike locations on this hardened technique are also studied, and the area penalty is also discussed. When we combine the layout technique that utilizes the quenching effect with the proposed source-isolation layout technique, the RHBD standard-cell library can be further exploited for additional P-hit SET mitigation in the spaceborne integrated-circuit design.
  • Keywords
    CAD; CMOS integrated circuits; electronic engineering computing; integrated circuit design; numerical analysis; P-hit single-event transient mitigation; RHBD standard-cell library; SET pulsewidth reduction; combinational standard cell; layout technique; source isolation; source-isolation layout design methodology; spaceborne integrated-circuit design; technology-computer-aided-design numerical simulations; twin-well CMOS technology; Electric potential; Integrated circuit modeling; Layout; Numerical models; Simulation; Substrates; Transistors; Bipolar effect; radiation hardened by design (RHBD); single-event transient (SET); source-isolation layout technique;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2191971
  • Filename
    6175113