In situ Observations and Quantitative Analysis of Short Circuit Probability Due to Ultrahigh Frequency Fatigue

Author

Eberl, Christoph ; Riesch-Oppermann, Heinz ; Spolenak, Ralph ; Kubat, Franz ; Ruile, Werner ; Courty, Diana ; Kraft, Oliver

Author_Institution

Inst. fur Zuverlassigkeit von Bauteilen und Systemen, Karlsruhe Inst. of Technol., Karlsruhe, Germany

Volume

10

Issue

3

fYear

2010

Firstpage

366

Lastpage

373

Abstract

Ultrahigh frequency fatigue (GHz) can lead to the formation of extrusions in aluminum thin film metallizations. Protruding from the surface, such extrusions can connect adjacent electrodes leading to the formation of short circuits. In situ observations presented in this paper verify this belief. Based on measurements from ex situ experiments, we present a defect-based probabilistic model to predict the failure probability, allowing to estimate the lifetime of test devices undergoing such load conditions.

Keywords

aluminium; extrusion; failure analysis; fatigue testing; metallisation; probability; surface acoustic wave devices; thin films; Al; aluminum thin film metallizations; defect-based probabilistic model; electrodes; failure probability; in situ observations; quantitative analysis; short circuit probability; test devices; ultrahigh frequency fatigue; Circuit analysis; Circuit testing; Electrodes; Fatigue; Frequency; Life estimation; Lifetime estimation; Metallization; Predictive models; Thin film circuits; Fatigue; mechanical properties; probabilistic approach; reliability; short circuit; surface acoustic wave (SAW); thin films; very high cycle fatigue (VHCF); weakest link;

fLanguage

English

Journal_Title

Device and Materials Reliability, IEEE Transactions on

Publisher

ieee

ISSN

1530-4388

Type

jour

DOI

10.1109/TDMR.2010.2047945

Filename

5454329