Title :
Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application
Author :
Hu, Sanming ; Xiong, Yong-Zhong ; Wang, Lei ; Li, Rui ; Shi, Jinglin ; Lim, Teck-Guan
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore
fDate :
5/1/2012 12:00:00 AM
Abstract :
This paper presents a cavity-backed slot (CBS) antenna for millimeter-wave applications. The cavity of the antenna is fully filled by polymer material. This filling makes the fabrication of a silicon CBS antenna feasible, reduces the cavity size by 76.8%, and also maintains the inherent high-gain and wide bandwidth. In addition, a through-silicon via-based architecture is proposed to integrate the 135-GHz CBS antenna with active circuits for a complete system-in-package. Results show that the proposed structure not only reduces the footprint size but also suppresses the electromagnetic interference.
Keywords :
active networks; interference suppression; millimetre wave antennas; polymers; slot antennas; system-in-package; three-dimensional integrated circuits; TSV-based system-in-package application; active circuit; cavity size; cavity-backed slot antenna; compact high-gain mmwave antenna; electromagnetic interference suppression; frequency 135 GHz; millimeter-wave application; polymer material; silicon CBS antenna fabrication; through-silicon via-based architecture; Antenna measurements; Cavity resonators; Frequency measurement; Gain; Horn antennas; Polymers; Cavity-backed slot (CBS) antenna; electromagnetic interference (EMI); millimeter-wave (mmWave); system-in-package (SiP); through-silicon via (TSV);
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2188293
