Title :
Structural and Electrical Characteristics of
Dielectric Embedded MIM Capacitors for Analog IC Applications
Author :
Mondal, Somnath ; Shih, Shao-Ju ; Chen, Fa-Hsyang ; Pan, Tung-Ming
Author_Institution :
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
fDate :
6/1/2012 12:00:00 AM
Abstract :
In this study, we develop a high-performance metal-insulator-metal (MIM) capacitor using a high- k Lu2 O3 amorphous film for radio-frequency and mixed-signal applications. The Ni/ Lu2O3/TaN capacitor exhibited a high capacitance density, a low leakage-current density, and a relatively low quadratic voltage coefficient of capacitance. The leakage current at the low electric field (<; 1.4 MV/cm) was dominated by the Schottky emission, whereas the Poole-Frenkel effect plays in the high electric field. In addition, the effects of constant voltage stress on leakage current and voltage linearity were comprehensively investigated, and excellent device reliability was also demonstrated. The Ni/ Lu2O3/TaN MIM capacitor appears to be very promising for future IC technologies.
Keywords :
MIM devices; amorphous semiconductors; analogue integrated circuits; capacitors; current density; high-k dielectric thin films; lutetium compounds; semiconductor device reliability; Lu2O3; Poole-Frenkel effect; analog IC applications; constant voltage stress; device reliability; dielectric embedded MIM capacitors; high-k amorphous film; high-performance metal-insulator-metal capacitor; leakage current; leakage-current density; mixed-signal applications; quadratic voltage coefficient; radiofrequency applications; voltage linearity; Capacitance; Dielectrics; Electrodes; Leakage current; MIM capacitors; Nickel; Stress; $hbox{Lu}_{2}hbox{O}_{3}$; Ni; TaN; metal–insulator–metal (MIM) capacitor; reliability;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2012.2189862