The background magnets of the Samsung Superconductor Test Facility (SSTF)

Author

Baang, Sungkeun ; Kim, Keeman ; Kim, Yongjin ; Park, Hyunki ; Kim, Sangbo ; Wang, Qiuliang ; Alexeev, Mikhail P. ; Anashkin, Oleg P. ; Ivanov, Denis P. ; Keilin, Victor E. ; Kovalev, Ivan A. ; Kruglov, Sergei L. ; Lysenko, Valery V. ; Miklyaev, Sergei M.

Author_Institution

Samsung Adv Inst. of Technol., Taejon, South Korea

Volume

11

Issue

1

fYear

2001

fDate

3/1/2001 12:00:00 AM

Firstpage

2082

Lastpage

2085

Abstract

The background magnet system of SSTF (Samsung Superconductor Test Facility) for KSTAR (Korea Superconducting Tokamak Advanced Research) is now under design. The main coil (MC) is split solenoids and the gap can be changed from 0 to 750 mm. The ID of MC is 750 mm. It will be wound using a CICC (cable-in-conduit conductor) designed for the central solenoid of KSTAR. The central field is 8 T at 22.5 kA when the gap is 250 mm. The ramp rate of MC is 3 T/s. A pair of blip coils will simulate (during the discharge) 1 T amplitude and 20 T/s rate electromagnetic disturbances expected from the KSTAR operation. To compensate the inductive interaction between MC and blip coils during the discharge of the blip coils, a pair of cancellation coils is foreseen. Both blip and cancellation coils (BCC) are fed in series and generate 1 T central field at 7 kA and 250 mm gap. The BCC are wound with CICC and cooled internally and externally

Keywords

superconducting cables; superconducting coils; superconducting magnets; test facilities; 0 to 750 mm; 1 T; 22.5 kA; 7 kA; 8 T; KSTAR; Korea Superconducting Tokamak Advanced Research; Samsung Superconductor Test Facility; blip coils discharge; cable-in-conduit conductor; cancellation coils; electromagnetic disturbances; inductive interaction compensation; split solenoids; Conductors; Niobium-tin; Solenoids; Superconducting cables; Superconducting coils; Superconducting magnets; Test facilities; Testing; Tokamaks; Wounds;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.920266

Filename

920266