Title :
Electrohydrodynamic flow induced by surface dielectric barrier discharge in narrow channels
Author :
Takeuchi, Nozomi ; Yasuoka, Koichi
Author_Institution :
Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
fDate :
4/1/2011 12:00:00 AM
Abstract :
A surface dielectric barrier discharge induces a gas flow called an electrohydrodynamic (EHD)flow. Flow velocity measurements with a laser Doppler velocimeter (LDV) have indicated that the driving force of the EHD flow exists within a height of less than 0.3 mm from the dielectric barrier, and therefore, EHD flow generation in a narrow channel of a submillimeter order was attempted by placing a dielectric plate over the discharge. However, a positive charge that accumulated on the inner surface of the upper plate probably weakened the driving force, resulting in no EHD flow in a rectangular channel with a height of 0.5 mm. To prevent such unipolar charge accumulation, the discharge was also generated on the upper inner surface and an EHD flow could then be generated in the narrow channel. Thus, generating the discharge along the inner surface of a channel effectively makes the driving force stronger. Although the driving force could be induced in a channel of a submillimeter order or less, the minimum channel size for EHD flow generation was limited by an increase in pressure loss with decreasing channel size.
Keywords :
Doppler measurement; electrohydrodynamics; flow measurement; laser velocimetry; microchannel flow; surface discharges; EHD flow; dielectric barrier; dielectric plate; electrohydrodynamic flow; flow velocity measurements; gas flow; laser Doppler velocimeter; narrow channel; pressure loss; size 0.5 mm; surface dielectric barrier discharge; unipolar charge accumulation; Dielectrics; Discharges; Electrodes; Fluid flow measurement; Surface discharges; Velocity measurement; Voltage measurement; Electrohydrodynamics (EHD); gas pump; narrow channel; surface dielectric barrier discharge;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2011.5739470