DocumentCode
1482884
Title
CEDA Currents
Volume
28
Issue
2
fYear
2011
Firstpage
78
Lastpage
79
Abstract
This month´s CEDA Currents newsletter addresses thermal-aware floorplanning for 3D MPSoCs; design automation and Smart Grid II; the IEEE Embedded Systems Letters´ most-accessed articles recently; and upcoming CEDA events.
Keywords
DAC 2011; DATC; FMCAD 2011; GLSVLSI 2011; IEEE Embedded Systems Letter; MPSoC; MemoCODE 2011; PATMOS 2011; VLSI-SoC 2011; design and test; floorplanning; thermal-aware;
fLanguage
English
Journal_Title
Design & Test of Computers, IEEE
Publisher
ieee
ISSN
0740-7475
Type
jour
DOI
10.1109/MDT.2011.29
Filename
5739846
Link To Document