• DocumentCode
    1483102
  • Title

    Interconnections-addressing the next challenge of IC technology (part I: integration and packaging trends)

  • Author

    Schutt-Aine, J.E. ; Sung-Mo Kang

  • Author_Institution
    University Of Illinois
  • Volume
    89
  • Issue
    4
  • fYear
    2001
  • fDate
    4/1/2001 12:00:00 AM
  • Firstpage
    423
  • Lastpage
    425
  • Keywords
    Bandwidth; Design engineering; Electronics packaging; Fabrication; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit packaging; LAN interconnection; Submillimeter wave technology; Working environment noise;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/JPROC.2001.920574
  • Filename
    920574
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1483102