1483102

Interconnections-addressing the next challenge of IC technology (part I: integration and packaging trends)

Schutt-Aine, J.E. ; Sung-Mo Kang

University Of Illinois

89

4

2001

4/1/2001 12:00:00 AM

423

425

Bandwidth; Design engineering; Electronics packaging; Fabrication; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit packaging; LAN interconnection; Submillimeter wave technology; Working environment noise;

English

Proceedings of the IEEE

ieee

0018-9219

jour

10.1109/JPROC.2001.920574

920574