• DocumentCode
    1483631
  • Title

    Designing and Modeling for Power Integrity

  • Author

    Swaminathan, Madhavan ; Chung, Daehyun ; Grivet-Talocia, Stefano ; Bharath, Krishna ; Laddha, Vishal ; Xie, Jianyong

  • Author_Institution
    Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    52
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    288
  • Lastpage
    310
  • Abstract
    After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency- and time-domain waveforms using a test vehicle. The modeling of RPD in practical packages and printed circuit boards is addressed along with substrate coupling due to nonideal reference planes. Finally, a high-impedance power distribution scheme for I/O signaling is presented that can potentially solve a number of RPD-related problems, followed by future challenges.
  • Keywords
    electronics packaging; printed circuits; I/O signaling; frequency-domain waveforms; high-impedance power distribution scheme; nonideal reference planes; power distribution design; power integrity modelling; printed circuit boards; return path discontinuity; substrate coupling; switching noise; time-domain waveforms; Circuit noise; Circuit testing; Coupling circuits; Frequency; Packaging; Power distribution; Printed circuits; Signal design; Time domain analysis; Vehicles; Macro-modeling; passivity; power distribution; power integrity; return path discontinuity; signal integrity;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2010.2045382
  • Filename
    5458046