Title :
Designing and Modeling for Power Integrity
Author :
Swaminathan, Madhavan ; Chung, Daehyun ; Grivet-Talocia, Stefano ; Bharath, Krishna ; Laddha, Vishal ; Xie, Jianyong
Author_Institution :
Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
5/1/2010 12:00:00 AM
Abstract :
After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency- and time-domain waveforms using a test vehicle. The modeling of RPD in practical packages and printed circuit boards is addressed along with substrate coupling due to nonideal reference planes. Finally, a high-impedance power distribution scheme for I/O signaling is presented that can potentially solve a number of RPD-related problems, followed by future challenges.
Keywords :
electronics packaging; printed circuits; I/O signaling; frequency-domain waveforms; high-impedance power distribution scheme; nonideal reference planes; power distribution design; power integrity modelling; printed circuit boards; return path discontinuity; substrate coupling; switching noise; time-domain waveforms; Circuit noise; Circuit testing; Coupling circuits; Frequency; Packaging; Power distribution; Printed circuits; Signal design; Time domain analysis; Vehicles; Macro-modeling; passivity; power distribution; power integrity; return path discontinuity; signal integrity;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2010.2045382