The ultra clean sputtering process and high density magnetic recording media

Author

Takahashi, Migaku ; Kikuchi, Akira ; Kawakita, Shinya

Author_Institution

Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan

Volume

33

Issue

5

fYear

1997

fDate

9/1/1997 12:00:00 AM

Firstpage

2938

Lastpage

2943

Abstract

The ultra clean sputtering process (UC-process) was newly introduced in the fabrication of CoNiCr and CoCrTa thin film media to establish the new concept of controlling the microstructure and magnetic properties. The relation between cleanness during film deposition process and magnetic properties has been discussed in connection with their microstructure. The UC-process presented enables the control of the fine structure of the thin film media and resulted in excellent magnetic properties. This study demonstrates that the UC-process is very superior to the normal process presently used and plays a dominant role for the thin film media fabrication

Keywords

chromium alloys; cobalt alloys; coercive force; magnetic recording; magnetic recording noise; magnetic thin films; nickel alloys; sputter deposition; tantalum alloys; CoCrTa; CoNiCr; film deposition process; fine structure; high density magnetic recording media; magnetic properties; microstructure; thin film media fabrication; ultra clean sputtering process; Argon; Coercive force; Fabrication; Impurities; Magnetic films; Magnetic properties; Magnetic recording; Microstructure; Sputtering; Substrates; Transistors;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.617804

Filename

617804