DocumentCode :
1483973
Title :
Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays
Author :
Jin, Xuecheng ; Oralkan, Ö ; Degertekin, F. Levent ; Khuri-Yakub, Butrus T.
Author_Institution :
Edward L. Ginzton Lab., Stanford Univ., CA, USA
Volume :
48
Issue :
3
fYear :
2001
fDate :
5/1/2001 12:00:00 AM
Firstpage :
750
Lastpage :
760
Abstract :
We report on the characterization of 1D arrays of capacitive micromachined ultrasonic transducers (cMUT). A 275/spl times/5600 /spl mu/m 1D CMUT array element is experimentally characterized, and the results are found to be in agreement with theoretical predictions. As a receiver, the transducer has a 0.28-fm//spl radic/Hz displacement sensitivity, and, as a transmitter, it produces 5 kPa/V of output pressure at the transducer surface at 3 MHz with a DC bias of 35 V. The transducer has more than 100% fractional bandwidth around 3 MHz, which makes it suitable for ultrasound imaging. The radiation pattern of isolated single elements, as well as those of array elements are measured, and two major sources of acoustical crosstalk are identified. A weakly dispersive non-leaky interface wave (Stoneley wave) is observed to be propagating at the silicon substrate-fluid interface at a speed close to the speed of sound in the fluid. This wave causes internal reflections, spurious resonance, and radiation from the edges of the silicon substrate. The large lateral component of the particle velocity generated by the membranes at the edge of the cMUT array elements is found to be the source of this interface wave. Lowest order Lamb waves in the silicon substrate are also found to contribute to the crosstalk between elements. These waves are excited at the edges of individual vibrating membranes, where they are anchored to the substrate, and result in a narrowing of the beam profile of the array elements. Several methods, such as trench isolation and wafer thinning, are proposed and implemented to modify the acoustical cross coupling between array elements.
Keywords :
acoustic receivers; capacitive sensors; crosstalk; equivalent circuits; isolation technology; membranes; micromachining; microsensors; surface acoustic wave transducers; ultrasonic imaging; ultrasonic transducer arrays; 1D arrays; 275 micron; 3 MHz; 5600 micron; Si; Stoneley wave; acoustic crosstalk sources; acoustic receiver; acoustic transmitter; acoustical cross coupling; beam profile narrowing; capacitive micromachined US transducers; displacement sensitivity; equivalent circuit model; immersion transducer arrays; internal reflections; isolated single elements; large lateral component; lowest order Lamb waves; membranes; radiation pattern; silicon substrate-fluid interface; spurious resonance; trench isolation; two-port network; ultrasound imaging; wafer thinning; Acoustic imaging; Acoustic transducers; Bandwidth; Biomembranes; Crosstalk; Silicon; Transmitters; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/58.920706
Filename :
920706
Link To Document :
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