• DocumentCode
    1484092
  • Title

    Specular spectroscopic scatterometry

  • Author

    Niu, Xinhui ; Jakatdar, Nickhil ; Bao, Junwei ; Spanos, Costas J.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
  • Volume
    14
  • Issue
    2
  • fYear
    2001
  • fDate
    5/1/2001 12:00:00 AM
  • Firstpage
    97
  • Lastpage
    111
  • Abstract
    Scatterometry is one of the few metrology candidates that has true in situ/in-line potential for deep submicrometer critical dimension (CD) and profile analysis. Most existing scatterometers are designed to measure multiple incident angles at a single wavelength on periodic gratings. We extend this idea by deploying specular spectroscopic scatterometry. Specular spectroscopic scatterometry (SS) is designed to measure the zeroth-order diffraction response at a fixed angle of incidence and multiple wavelengths. This mechanism allows the use of existing thin-film metrology equipment, such as spectroscopic ellipsometers, to accurately extract topographic profile information from one-dimensional (1-D) periodic structures. In this work, we developed the grating tool-kit (gtk), which implements several variants of rigorous coupled-wave analysis (RCWA) to accurately and efficiently simulate diffraction behavior of 1-D gratings. Theoretical simulations using this package show that specular spectroscopic scatterometry can be applied in the current semiconductor manufacturing technology, and can be easily extended to the 0.07-μm generation. We have also applied a library-based profile extraction methodology to resist and poly focus-exposure matrices patterned using 0.25and 0.18-μm lithography and etch technology, respectively, to extract their cross-sectional profiles. Discrepancies between CD-SEM, CD-AFM, and SSS measurements are discussed and explained
  • Keywords
    VLSI; ellipsometry; integrated circuit measurement; photolithography; surface topography; 0.07 to 0.25 micron; CD-AFM; CD-SEM; SSS measurements; cross-sectional profiles; deep submicrometer critical dimension; diffraction behavior; focus-exposure matrices; library-based profile extraction methodology; multiple wavelengths; photolithography; profile analysis; rigorous coupled-wave analysis; spectroscopic ellipsometers; specular spectroscopic scatterometry; thin-film metrology equipment; topographic profile information; zeroth-order diffraction response; Analytical models; Data mining; Diffraction gratings; Goniometers; Metrology; Periodic structures; Radar measurements; Spectroscopy; Transistors; Wavelength measurement;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.920722
  • Filename
    920722