Title :
Correction to "Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices" [Aug 03 283-288]
Author :
Tao, Yong ; Malshe, Ajay P. ; Brown, Wiliam D. ; DeReus, Dana R. ; Cunningham, Shawn
fDate :
5/1/2010 12:00:00 AM
Abstract :
In the above titled paper (ibid., vol. 26, no. 3, pp. 283-288, Aug. 03), the biography of Ajay P. Malshe should have appeared as it is presented here.
Keywords :
Biographies; Ceramics; Chemical lasers; Machining; Mechanical engineering; Micromechanical devices; Packaging machines; Springs; Testing; Wafer scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2010.2049287
