DocumentCode
1484912
Title
ELECTRONIC PACKAGING MATERIALS SCIENCE VIII [Books]
Author
Schoch, K.F.
Volume
12
Issue
4
fYear
1996
Firstpage
43
Keywords
Assembly; Books; Electronics packaging; Impulse testing; Integrated circuit interconnections; Integrated circuit packaging; Lead; Materials science and technology; Polymer films; Voltage;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/MEI.1996.526950
Filename
526950
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