DocumentCode :
1484912
Title :
ELECTRONIC PACKAGING MATERIALS SCIENCE VIII [Books]
Author :
Schoch, K.F.
Volume :
12
Issue :
4
fYear :
1996
Firstpage :
43
Keywords :
Assembly; Books; Electronics packaging; Impulse testing; Integrated circuit interconnections; Integrated circuit packaging; Lead; Materials science and technology; Polymer films; Voltage;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.1996.526950
Filename :
526950
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1484912
